NXP Adds LPC1100XL Low Power Platform and EEPROM to Cortex-M0 Portfolio
(Marketwire (Canada) Via Acquire Media NewsEdge) EINDHOVEN, THE NETHERLANDS and SAN JOSE, CA--(Marketwire - March 01, 2012) - NXP Semiconductors N.V. (NASDAQ: NXPI) today released the LPC1100XL microcontroller series featuring extra-low power. With the industry's lowest active power consumption at 110 uA/MHz and reduced deep sleep current below 2 uA, the LPC1100XL has set a new benchmark for low-power ARM(R) Cortex(TM)-M0 microcontrollers. Also today, NXP announced the new LPC11E00 series for space-constrained applications requiring dedicated EEPROM. The LPC11E00 extends the range of options available in the NXP Cortex-M0 portfolio, including integrated USB, CAN, Segment LCD -- and now EEPROM.
"We continue to outperform the industry in delivering the lowest power Cortex-M0 MCUs on the market, allowing designers to do even more with less power," said Jan Jaap Bezemer, director of marketing, microcontroller business line, NXP Semiconductors. "At the same time, we continue to integrate new features such as memory extensions to 64KB Flash and EEPROM without sacrificing our low power commitment to customers."
LPC1100XL: Extra Low-Power Cortex-M0 Microcontrollers
The dramatic reductions in power consumption in the LPC1100XL are complemented by on-chip "power profiles" -- a unique industry implementation of real-time power management. Optimized for CPU performance, efficiency and lowest active current, the power profiles enable maximum operating frequency through the entire voltage range from 1.8V to 3.6V without compromising speed or functionality, making the LPC1100XL an ideal choice for all low-power 8/16-bit applications.
The LPC1100XL incorporates NXP's proprietary embedded flash which extends solutions to 64 KB while incorporating 256 bytes of page erase. The 256-byte page-erase feature significantly improves the efficiency and ease of use of the on-chip flash, allowing for seamless field updates without having to erase a large sector to write the next page.
LPC11E00: Integrated EEPROM for a Smaller Footprint
The new LPC11E00 series features 4 KB of integrated EEPROM for space-constrained applications such as medical and industrial measuring devices. This removes the need for external serial EEPROM, saving up to 15 mm2 of PCB real estate and reducing electrical interconnect, while providing the added security of the microcontroller. The LPC11E00 with 10K SRAM and 32 KB Flash is a feature-rich solution and maximizes connectivity with 2 SSP, USART with smart card interface and I2C Fm+ and 54 GPIO pins.
The on-chip ROM in the LPC11E00 series includes a 32-bit divide library with an API interface offering several times the arithmetic performance of software-based libraries, as well as a highly deterministic cycle time combined with reduced Flash code size. Access to the 4 KB EEPROM on the LPC11E00 is simplified with an API interface which is also integrated in on-chip ROM.
Extensive Ecosystem Support
The LPC1100XL and LPC11E00 series is supported by a wide range of third-party development tools, as well as NXP's LPCXpresso development platform. LPCXpresso features a powerful Eclipse-based IDE with an intuitive NXP-designed user interface, optimized Cortex-M0 compiler and libraries. Designed for simplicity and ease of use, LPCXpresso gives designers a quick and easy way to work with the microcontrollers, enabling anyone to develop with Cortex-M0.
Key specifications for the LPC1100XL and LPC11E00 devices include:
Speeds of up to 50 MHz
LPC1100XL -- Up to 64K Flash, 8K SRAM
LPC11E00 -- Up to 32K Flash, 10K SRAM
32 vectored interrupts; 4 priority levels; dedicated interrupts on up to 13 GPIOs
UART (LPC1100XL), USART (LPC11E00),1-2 SSP, I2C (Fm+) as serial peripherals
Two 16-bit and two 32-bit timers with PWM/Match/Capture
12 MHz internal RC oscillator with 1 percent accuracy over temperature and voltage
Power-On-Reset (POR); multi-level Brown-Out-Detect (BOD); Phase-Locked Loop (PLL)
8-channel high-precision 10-bit ADC with ±1 LSB DNL
Up to 54 GPIO pins (LPC11E00) and up to 42 GPIO pins (LPC1100XL)
The LPC1100XL series is available today in 48K, 56K and 64K Flash options. These devices are currently available in distribution worldwide. Additional family members and package configurations will be available at the end of Q2 2012.
The LPC11E00 series is available in distribution today.
LPC1100XL product information page:
LPC11E00 product information page:
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.
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Source: NXP Semiconductors
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