Research and Markets: Handbook of Wafer Bonding
(M2 PressWIRE Via Acquire Media NewsEdge) Dublin - Research and Markets (http://www.researchandmarkets.com/research/vxx8mk/handbook_of_wafer) has announced the addition of John Wiley and Sons Ltd's new book "Handbook of Wafer Bonding" to their offering.
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies.
Part I sorts the wafer bonding technologies into four categories - Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.
This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Key Topics Covered:
- Glass Frit Wafer Bonding
- Wafer Bonding Using Spin-On Glass as Bonding Material
- Polymer Adhesive Wafer Bonding
- Anodic Bonding
- Direct Wafer Bonding
- Plasma-Activated Bonding
- Au/Sn Solder
- Eutectic Au-In Bonding
- Thermocompression Cu-Cu Bonding of Blanket and Patterned Wafers
- Wafer-Level Solid-Liquid Interdiffusion Bonding
- Hybrid Metal/Polymer Wafer Bonding Platform
- Cu/SiO2 Hybrid Bonding
- Metal/Silicon Oxide Hybrid Bonding
- Microelectromechanical Systems
- Three-Dimensional Integration
- Temporary Bonding for Enabling Three-Dimensional Integration and Packaging
- Temporary Adhesive Bonding with Reconfi guration of Known Good Dies for Three-Dimensional Integrated Systems
- Thin Wafer Support System for above 250 ?C Processing and Cold De-bonding
- Temporary Bonding: Electrostatic
Dr. Peter Ramm, James Jian-Qiang Lu, Dr. Maaike M.V. Taklo
For more information, including full table of contents and authors' bio, please visit http://www.researchandmarkets.com/research/vxx8mk/handbook_of_wafer
Source: John Wiley and Sons Ltd
Research and Markets,
Fax from USA: 646-607-1907
Fax from rest of the world: 353-1-481-1716
Sector: Semiconductor (http://www.researchandmarkets.com/categories.asp?cat_id=102&campaign_id=vxx8mk), Electrical Engineering (http://www.researchandmarkets.com/categories.asp?cat_id=294&campaign_id=vxx8mk), Physics (http://www.researchandmarkets.com/categories.asp?cat_id=359&campaign_id=vxx8mk)
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