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TMCNet:  Innovative, High-Performance Interconnect Technology and Expertise at Super Computing 2012; Company leaders showcase depth of knowledge a range of products/solutions in Booth 3745

[November 14, 2012]

Innovative, High-Performance Interconnect Technology and Expertise at Super Computing 2012; Company leaders showcase depth of knowledge a range of products/solutions in Booth 3745

(M2 PressWIRE Via Acquire Media NewsEdge) LISLE, IL -- Molex Incorporated will showcase its proven expertise in high-speed, high-density and high-signal integrity interconnect technology at Super Computing 2012, November 12-15 in Salt Lake City, UT. Company thought leaders will conduct ongoing product demonstrations in Booth 3745.


Products Showcased Molex will have on display the following high-speed interconnect products and solutions: 25 Gbps QSFP+ Silicon Photonics Based Active Optical Cables : Molex recently demonstrated a 100 Gbps QSFP+ Active Optical Cable based on silicon photonics single chip transceiver technology enabling next generation 100 Gbps optical interconnect applications.

Quad Small Form-factor Pluggable (QSFP+) 40 Gbps QDR and 56 Gbps Active Optical Cable (AOC) Assemblies : Providing the longest link distance and lowest power consumption on the market today, the assemblies achieve 40 and 56 Gbps data rates over long reaches of up to 4 km (2.49 miles) using only 0.78 and 1 W per cable end, respectively.

z-Quad Small Form-factor Pluggable Plus (zQSFP+) Interconnect Solution : Designed for next-generation high-density applications found in high performance computing, telecommunications, data networking, test and measurement and medical diagnostic equipment.

iPass+(TM) (HSC) CXP Copper and Optical Systems : Enables twelve channels of 10 Gbps data for up to 120 Gbps of total bandwidth; with the enhanced-footprint integrated connectors enabling ten channels of 10 Gbps data, for up to 100 Gbps of total bandwidth.

zSFP+ Connector Solutions : Supports 25 Gbps applications, with backward compatibility for 10 Gbps Ethernet and 16 Gbps Fibre Channel applications.

Product Demonstration Molex will demonstrate zQSFP+ stacked thermal management technologies. Wind tunnel testing has been found to offer the most accurate, repeatable test method. Data is generated that will support design of NEBS rated applications with current and next generation pluggable I/O modules.

To receive information on other Molex products and industry solutions, please sign up for our e-nouncement newsletter at http://www.molex.com/link/register .

About Molex Incorporated Providing more than connectors, Molex delivers complete interconnect solutions for a number of markets including data communications, telecommunications, consumer electronics, industrial, automotive, medical, military and lighting. Established in 1938, the company operates 40 manufacturing locations in 16 countries. The Molex website is http://www.molex.com . Follow us at www.twitter.com/molexconnectors , watch our videos at www.youtube.com/molexconnectors , connect with us at www.facebook.com/molexconnectors and read our blog at www.connector.com .

Molex is a registered trademark of Molex Incorporated Other trademarks referenced in this release are the property of their respective owners ((M2 Communications disclaims all liability for information provided within M2 PressWIRE. Data supplied by named party/parties. Further information on M2 PressWIRE can be obtained at http://www.presswire.net on the world wide web. Inquiries to info@m2.com)).

(c) 2012 M2 COMMUNICATIONS

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