[December 06, 2012]

Vitesse Broadband Expert to Lead Industry Panel Addressing Future of Optical Wireless Access

Vitesse Semiconductor Corporation (NASDAQ: VTSS), a leading provider of advanced IC solutions for Carrier and Enterprise networks, announced that one of its technology experts will chair an optical wireless access forum at the 2012 IEEE (News - Alert) Global Communications Conference, today at the Disneyland Resort Hotel in Anaheim, California.

Dr. Frank Chang will moderate the technical panel "Optical Wireless Access: What's Next Down the Road." Discussion topics will focus on fiber penetration into broadband end users for the convergence of wireline and wireless access networks, broadband access and service delivery architecture, solutions as well as upcoming technologies, and applications. Industry experts from Google (News - Alert), Huawei, Ericsson, NTT, Verion and Vitesse Semiconductor among others will deliver different perspectives and answer questions.

Dr. Chang is a principal systems engineer at Vitesse and specializes in optical systems engineering and IC product specifications along with definition issues for telecom, datacom and PON access markets. Dr. Chang represents Vitesse as an active contributor to standard-setting bodies including OIF (News - Alert)/ITU, IEEE 802.3 and FSAN and has authored or co-authored over 75 peer-reviewed journal and conference articles.

For more information about IEEE GLOBECOM 2011, please visit http://www.ieee-globecom.org/index.html.

About Vitesse

Vitesse (NASDAQ: VTSS) designs a diverse portfolio of high-performance semiconductor solutions for Carrier and Enterprise networks worldwide. Vitesse products enable the fastest-growing network infrastructure markets including Mobile Access/IP Edge, Cloud Computing and SMB/SME Enterprise Networking. Visit www.vitesse.com or follow us on Twitter (News - Alert) @VitesseSemi.

Vitesse is a registered trademark of Vitesse Semiconductor Corporation in the United States and other jurisdictions. All other trademarks or registered trademarks mentioned herein are the property of their respective holders.

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