It was a fairly busy week in SIP Trunking. Let's take a look at some of the most prominent developments.
The SIP Forum has been working to advance the adoption and interoperability of IP communications products and services based on SIP. To further drive industry-wide adoption of the SIPconnect 1.1 technical specification, the Forum has announced a new SIP trunking interoperability testing initiative, the SIPconnect-IT 2012, to be held December 3-7, 2012 at the University of New Hampshire Interoperability Laboratory (UNH-IOL)’s 32,000-square-foot facility in Durham, NH.
SIPconnect-IT 2012 testing will provide a venue where attendees can perform technical interoperability testing among and between products or services that use the SIPconnect 1.1 technical specification published by the SIP Forum.
TMCnet contributor Ed Silverstein reported that Interop will work with SIP Forum to identify “interworking” issues and develop a process to resolve disputes to speed up adoption and implementation of the standard. Consequently, as per the report, there will be a formal, comprehensive SIPconnect 1.1 Compliance Program.
As a result, formal testing certification will be offered to ensure compliance with the new standard, wrote Silverstein.
The report quoted a statement from SIP Forum president Marc Robins: “SIPconnect-IT 2012 marks an important step in galvanizing the industry toward universal adoption of and compliance with the SIPconnect 1.1 Specification.”
Separately, to accelerate the adoption of SIP based communications, global SIP provider Ingate Systems is planning a SIP Trunking and unified communications seminar at ITEXPO West next. TMCnet Web editor Jamie Epstein reported that Ingate has made its schedule for the upcoming SIP Trunk - Unified Communications seminars at ITEXPO West 2012 public.
The report indicates that the three-day event will take place from October 3-5, 2012 at the Austin Convention Center in Austin, TX. Last week, TMCnet reported that Ingate Systems became a certified member of the Aastra Approval Partner Program. This accreditation basically means that the company’s applications and products can be used in conjunction with Aastra’s systems.
In another news, TMCnet contributor Carolyn J Dawson reported that semiconductor supplier On Semiconductor has developed a system-on-chip (SoC) solution to significantly reduce noise in VoIP phones, webcams and tablet computers. Called BelaSigna R262, it incorporates voice capture and noise diminution technology to considerably cut background and mechanical noise in these applications.
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