October 24, 2013
Cadence Minimizes Design-In Time for VIA Technologies
By
Anuradha Shukla
TMCnet Contributor
VIA (News - Alert) Technologies has chosen the Cadence Tensilica HiFi Audio/Voice DSP (digital signal processor) for a system-on-chip (SOC) design for set top box, tablets and mobile devices.
The Taiwan-based company was searching for a very low power audio DSP featuring a wide range of software codecs. VIA selected the Cadence Tensilica HiFi/Voice Audio DSP from Cadence Design Systems (News - Alert) after evaluating other vendors in the market.
Licensed by more than 50 customers, Cadence Tensilica HiFi Audio/Voice DSPs are one of the popular licensable audio DSP IP cores. Several of the top 10 semiconductor manufacturers and leading system OEMs are already using these products.
Cadence notes its HiFi Audio/Voice DSPs can support more than 100 audio and voice codecs and deliver very efficient processing at low power.
"This low power DSP fits well in our advanced SOC architecture and product lines. Our design-in time is also minimized due to the robustness of the complete codec support," said Michael Shiuan, vice president of Engineering at VIA Technologies.
Cadence enables global electronic design innovation and plays a significant role in the creation of today's integrated circuits and electronics. The company was in the news last week for introducing a high-performance FastSPICE simulator called Spectre XPS (eXtensive Partitioning Simulator).
This simulator is said to bring up to 10X faster throughput in contrast to competitive offerings, and allows designers to accurately measure timing. Built on the Cadence Spectre simulation platform, Spectre XPS is ideal for advanced-node, low-power mobile designs requiring high performance and accuracy.
Cadence adds that Spectre XPS reduces support costs while improving time to production by allowing the re-use of models, stimulus, analysis and overall methodology.
"With the order of magnitude performance improvement of Spectre XPS, we are able to meet required turnaround time and quality-of-results goals," said Suravi Bhowmik, manager, MCU Backplane, Embedded Processing, Texas Instruments (News - Alert) Incorporated.
Edited by Rory J. Thompson