SUBSCRIBE TO TMCnet
TMCnet - World's Largest Communications and Technology Community

CHANNEL BY TOPICS


QUICK LINKS




Cadence Minimizes Design-In Time for VIA Technologies

SIP Trunking Featured Article

October 24, 2013


Cadence Minimizes Design-In Time for VIA Technologies


By Anuradha Shukla
TMCnet Contributor

Tweet

VIA (News - Alert) Technologies has chosen the Cadence Tensilica HiFi Audio/Voice DSP (digital signal processor) for a system-on-chip (SOC) design for set top box, tablets and mobile devices.


The Taiwan-based company was searching for a very low power audio DSP featuring a wide range of software codecs. VIA selected the Cadence Tensilica HiFi/Voice Audio DSP from Cadence Design Systems (News - Alert) after evaluating other vendors in the market.

Licensed by more than 50 customers, Cadence Tensilica HiFi Audio/Voice DSPs are one of the popular licensable audio DSP IP cores. Several of the top 10 semiconductor manufacturers and leading system OEMs are already using these products.  

Cadence notes its HiFi Audio/Voice DSPs can support more than 100 audio and voice codecs and deliver very efficient processing at low power.

"This low power DSP fits well in our advanced SOC architecture and product lines. Our design-in time is also minimized due to the robustness of the complete codec support," said Michael Shiuan, vice president of Engineering at VIA Technologies.

Cadence enables global electronic design innovation and plays a significant role in the creation of today's integrated circuits and electronics. The company was in the news last week for introducing a high-performance FastSPICE simulator called Spectre XPS (eXtensive Partitioning Simulator).

This simulator is said to bring up to 10X faster throughput in contrast to competitive offerings, and allows designers to accurately measure timing. Built on the Cadence Spectre simulation platform, Spectre XPS is ideal for advanced-node, low-power mobile designs requiring high performance and accuracy.

Cadence adds that Spectre XPS reduces support costs while improving time to production by allowing the re-use of models, stimulus, analysis and overall methodology.

"With the order of magnitude performance improvement of Spectre XPS, we are able to meet required turnaround time and quality-of-results goals," said Suravi Bhowmik, manager, MCU Backplane, Embedded Processing, Texas Instruments (News - Alert) Incorporated.




Edited by Rory J. Thompson

Back to SIP Trunking Home ›





Technology Marketing Corporation

2 Trap Falls Road Suite 106, Shelton, CT 06484 USA
Ph: +1-203-852-6800, 800-243-6002

General comments: [email protected].
Comments about this site: [email protected].

STAY CURRENT YOUR WAY

© 2024 Technology Marketing Corporation. All rights reserved | Privacy Policy